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MMDF4P03HD Datasheet(PDF) 1 Page - ON Semiconductor

Part # MMDF4P03HD
Description  P-channel SO-8 Power MOSFET
PDF  8 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MMDF4P03HD Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 3
1
Publication Order Number:
MMDF4P03HD/D
MMDF4P03HD
Preferred Device
Power MOSFET
4 A, 30 V, P−Channel SO−8, Dual
Dual MOSFET devices are designed for use in low voltage, high
speed switching applications where power efficiency is important.
Typical applications are dc−dc converters, and power management in
portable and battery powered products such as computers, printers,
cellular and cordless phones. They can also be used for low voltage
motor controls in mass storage products such as disk drives and tape
drives.
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, With Soft Recovery
• IDSS Specified at Elevated Temperature
• Mounting Information for SO−8 Package Provided
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
30
Vdc
Gate−to−Source Voltage − Continuous
VGS
± 20
Vdc
Drain Current − Continuous @ TA = 25°C
Drain Current − Single Pulse (tp ≤ 10 ms)
ID
IDM
4.0
20
Adc
Apk
Source Current − Continuous @ TA = 25°C
IS
1.7
Adc
Total Power Dissipation @ TA = 25°C
(Note 1)
PD
2.0
Watts
Operating and Storage Temperature Range
TJ, Tstg
− 55 to
150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 30 Vdc, VGS = 5.0 Vdc,
VDS = 20 Vdc, IL = 9.0 Apk,
L = 10 mH, RG = 25 W)
EAS
450
mJ
Thermal Resistance − Junction−to−Ambient
RθJA
62.5
°C/W
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from Case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1 Mounted on G10/FR4 glass epoxy board using minimum recommended
footprint.
Source−1
1
2
3
4
8
7
6
5
Top View
Gate−1
Source−2
Gate−2
Drain−1
Drain−1
Drain−2
Drain−2
P−Channel
D
S
G
4 AMPERES
30 VOLTS
RDS(on) = 85 mW
Device
Package
Shipping†
ORDERING INFORMATION
MMDF4P03HDR2
SO−8
2500 Tape & Reel
SO−8, Dual
CASE 751
STYLE 11
MARKING
DIAGRAM
A
= Assembly Location
Y
= Year
WW
= Work Week
PIN ASSIGNMENT
Preferred devices are recommended choices for future use
and best overall value.
D
S
G
1
8
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DP0303
AYWW
1
8
http://onsemi.com


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