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MMDF4P03HD Datasheet(PDF) 1 Page - ON Semiconductor |
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MMDF4P03HD Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 8 page ![]() © Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 3 1 Publication Order Number: MMDF4P03HD/D MMDF4P03HD Preferred Device Power MOSFET 4 A, 30 V, P−Channel SO−8, Dual Dual MOSFET devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc−dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. • Low RDS(on) Provides Higher Efficiency and Extends Battery Life • Logic Level Gate Drive − Can Be Driven by Logic ICs • Miniature SO−8 Surface Mount Package − Saves Board Space • Diode Is Characterized for Use In Bridge Circuits • Diode Exhibits High Speed, With Soft Recovery • IDSS Specified at Elevated Temperature • Mounting Information for SO−8 Package Provided MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDSS 30 Vdc Gate−to−Source Voltage − Continuous VGS ± 20 Vdc Drain Current − Continuous @ TA = 25°C Drain Current − Single Pulse (tp ≤ 10 ms) ID IDM 4.0 20 Adc Apk Source Current − Continuous @ TA = 25°C IS 1.7 Adc Total Power Dissipation @ TA = 25°C (Note 1) PD 2.0 Watts Operating and Storage Temperature Range TJ, Tstg − 55 to 150 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 30 Vdc, VGS = 5.0 Vdc, VDS = 20 Vdc, IL = 9.0 Apk, L = 10 mH, RG = 25 W) EAS 450 mJ Thermal Resistance − Junction−to−Ambient RθJA 62.5 °C/W Maximum Lead Temperature for Soldering Purposes, (1/8″ from Case for 10 s) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1 Mounted on G10/FR4 glass epoxy board using minimum recommended footprint. Source−1 1 2 3 4 8 7 6 5 Top View Gate−1 Source−2 Gate−2 Drain−1 Drain−1 Drain−2 Drain−2 P−Channel D S G 4 AMPERES 30 VOLTS RDS(on) = 85 mW Device Package Shipping† ORDERING INFORMATION MMDF4P03HDR2 SO−8 2500 Tape & Reel SO−8, Dual CASE 751 STYLE 11 MARKING DIAGRAM A = Assembly Location Y = Year WW = Work Week PIN ASSIGNMENT Preferred devices are recommended choices for future use and best overall value. D S G 1 8 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. DP0303 AYWW 1 8 http://onsemi.com |
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