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P3P623S00B Datasheet(PDF) 3 Page - ON Semiconductor

Part # P3P623S00B
Description  Peak EMI Reduction Device
PDF  9 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

P3P623S00B Datasheet(HTML) 3 Page - ON Semiconductor

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P3P623S00B, P3P623S00E
www.onsemi.com
3
Table 2. PIN DESCRIPTION FOR P3P623S00E
Pin #
Pin Name
Type
Description
1
CLKIN (Note 1)
Input
External reference Clock input, 5 V tolerant input
2
CLKOUT1 (Note 2)
Output
Buffered clock output (Note 4)
3
VDD
Power
3.3 V supply
4
SS% (Note 3)
Input
Spread Spectrum Selection. Refer to the Spread Spectrum Control and Input−Output Skew
Table. Has an internal pull up resistor.
5
GND
Power
Ground
6
CLKOUT2 (Note 2)
Output
Buffered clock output (Note 4)
7
CLKOUT3 (Note 2)
Output
Buffered clock output (Note 4)
8
DLY_CTRL
Output
External Input−Output Delay control
9
SSON (Note 3)
Input
Spread Spectrum enable and disable option. When SSON is HIGH, the spread spectrum is
enabled and when LOW, it turns off the spread spectrum. Has an internal pull up resistor.
10
CLKOUT4 (Note 2)
Output
Buffered clock output (Note 4)
11
CLKOUT5 (Note 2)
Output
Buffered clock output (Note 4)
12
GND
Power
Ground
13
VDD
Power
3.3 V supply
14
CLKOUT6 (Note 2)
Output
Buffered clock output (Note 4)
15
CLKOUT7 (Note 2)
Output
Buffered clock output (Note 4)
16
CLKOUT (Note 2)
Output
Buffered clock output (Note 4)
1. Weak pull down
2. Weak pull−down on all outputs
3. Weak pull−up on these inputs
4. Buffered clock output is Timing−Safe
Table 3. SPREAD SPECTRUM CONTROL AND INPUT−OUTPUT SKEW
Device
Input Frequency
SS %
Deviation
Input−Output Skew
(
+TSKEW)
P3P623S00B/E
32 MHz
0
±0.25%
0.125
1
±0.50%
0.25
Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Rating
Unit
VDD
Supply Voltage to Ground Potential
−0.5 to +4.6
V
VIN
DC Input Voltage (CLKIN)
−0.5 to +7
TSTG
Storage temperature
−65 to +125
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
TDV
Static Discharge Voltage (As per JEDEC STD22− A114−B)
2
KV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.



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