DMTH4004SPSQ

Document number: DS37562 Rev. 3 - 2

2 of 7

www.diodes.com

October 2015

© Diodes Incorporated

DMTH4004SPSQ

Characteristic

Symbol

Value

Units

Drain-Source Voltage

40

V

Gate-Source Voltage

±20

V

Continuous Drain Current (Note 6)

31

26

A

Continuous Drain Current (Note 7)

100

A

(Note 9)

100

Maximum Continuous Body Diode Forward Current (Note 6)

100

A

Pulsed Drain Current (10µs pulse, duty cycle = 1%)

200

A

Avalanche Current, L=0.2mH

45

A

Avalanche Energy, L=0.2mH

200

mJ

Thermal Characteristics

Characteristic

Symbol

Value

Units

Total Power Dissipation (Note 6)

3.6

W

Thermal Resistance, Junction to Ambient (Note 6)

41

°C/W

Total Power Dissipation (Note 7)

167

W

Thermal Resistance, Junction to Case (Note 7)

0.9

°C/W

Operating and Storage Temperature Range

-55 to +175

°C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 8)

Drain-Source Breakdown Voltage

40

—

—

V

Zero Gate Voltage Drain Current

—

—

1

μA

Gate-Source Leakage

—

—

±100

nA

ON CHARACTERISTICS (Note 8)

Gate Threshold Voltage

2

—

4

V

Static Drain-Source On-Resistance

—

2.3

2.7

m

Ω

Diode Forward Voltage

—

0.9

1.2

V

DYNAMIC CHARACTERISTICS (Note 9)

Input Capacitance

—

4,305

—

pF

f = 1MHz

Output Capacitance

—

1,441

—

Reverse Transfer Capacitance

—

102

—

Gate resistance

—

0.77

—

Ω

Total Gate Charge

—

68.6

—

nC

Gate-Source Charge

—

16.8

—

Gate-Drain Charge

—

14.2

—

Turn-On Delay Time

—

9.5

—

nS

Turn-On Rise Time

—

6.7

—

Turn-Off Delay Time

—

26.4

—

Turn-Off Fall Time

—

8.1

—

Body Diode Reverse Recovery Time

—

52.4

—

nS

Body Diode Reverse Recovery Charge

—

78.2

—

nC

Notes:

6. Device mounted with exposed drain pad on 25mm by 25mm 2oz copper on a single- sided 1.6mm FR4 PCB; device is measured under still air conditions

whilst operating in a steady state.

7. Thermal resistance from junction to soldering point (on the exposed drain pad).

8. Short duration pulse test used to minimize self-heating effect.

9. Guaranteed by design. Not subject to production testing.