RC4580

SLOS412D – APRIL 2003 – REVISED NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

±18

V

Input voltage (any input)

±15

V

Differential input voltage

±30

V

Output current

±50

mA

Ambient temperature range

–40

125

°C

Storage temperature range

–60

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–60

125

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

0

1000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

0

1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

2

16

Supply voltage

V

–2

–16

Input common-mode voltage range

–13.5

13.5

V

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

RC4580

D

PW

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

109

163

Junction-to-case (top) thermal resistance

55.7

38

Junction-to-board thermal resistance

49

90.6

°C/W

Junction-to-top characterization parameter

10.6

1.3

Junction-to-board characterization parameter

48.6

88.9

Junction-to-case (bottom) thermal resistance

—

—

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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