Document Number: 31510

Revision 25-Oct-00

www.vishay.com

38

MSP

Vishay Dale

For Technical Questions, contact: ff2aresistors@vishay.com

Thick Film Resistor Networks

Single-In-Line, Molded SIP; 01, 03, 05 Schematics

6, 8, 9 or 10 Pin "A" Profile and 6, 8 or 10 Pin "C" Profile

FEATURES

• 0.195" [4.95mm] "A" or 0.350" [8.89mm] "C" maximum seated

height

• Highly stable thick film

• Low temperature coefficient (- 55

°C to + 125°C) ± 100ppm/°C

• Rugged, molded case construction

• Reduces total assembly costs

• Compatible with automatic insertion equipment and reduces PC

board space

• Wide resistance range

• Available in tube pack or side-by-side pack

STANDARD ELECTRICAL SPECIFICATIONS

MODEL/

PROFILE

RESISTOR

RESISTANCE

STANDARD

TEMPERATURE

TCR

OPERATING

SCHEMATIC

POWER RATING

RANGE

TOLERANCE

COEFFICIENT

TRACKING*

VOLTAGE

Max. @ 70

(- 55

Max.

W

Ω

± %

ppm/

ppm/

VDC

MSP01

A

0.20

10 - 2.2M

2 Standard

± 100

± 50ppm/°C

100

C

0.25

(1, 5, 10, 20)**

MSP03

A

0.30

10 - 2.2M

2 Standard

± 100

± 50ppm/°C

100

C

0.40

(1, 5, 10, 20)**

MSP05

A

0.20

10 - 2.2M

± 2 Standard

± 100

± 150ppm/°C

100

C

0.25

(

± 5%)**

PARAMETER

UNIT

MSP SERIES

Package Power Rating

See Derating Curves

(Maximum at + 25

°C and + 70°C

Voltage Coefficient of Resistance

V

eff

< 50ppm typical

Dielectric Strength

VAC

200

Isolation Resistance (03 Schematic)

Ω

> 100M

Operating Temperature Range

°C

- 55 to + 125

Storage Temperature Range

°C

- 55 to + 150

TECHNICAL SPECIFICATIONS

Marking Resistance to Solvents:

Permanency testing per MIL-STD-202, Method 215.

Solderability:

Per MIL-STD-202, Method 208E, RMA flux.

Body:

Molded epoxy.

Terminals:

Copper alloy, tin-lead plated.

Weight:

MSP06A = 0.4 gram

MSP06C = 0.7 gram

MSP08A = 0.5 gram

MSP08C = 0.9 gram

MSP09A = .55 gram

MSP10C = 1.1 gram

MSP10A = 0.6 gram

* Tighter tracking available

** Tolerances in brackets available on request

MECHANICAL SPECIFICATIONS