LMP7701MASLASHNOPB datasheet(5/44 Pages) TI1

5 / 44 page

LMP7701, LMP7702, LMP7704

www.ti.com

SNOSAI9I – SEPTEMBER 2005 – REVISED NOVEMBER 2015

Pin Functions - LMP7704

I/O

DESCRIPTION

NAME

SOIC, TSSOP

IN+

—

Noninverting Input

IN–

—

Inverting Input

IN A +

Noninverting Input for Amplifier A

IN A–

Inverting Input for Amplifier A

IN B+

Noninverting Input for Amplifier B

IN B–

Inverting Input for Amplifier B

IN C+

Noninverting Input for Amplifier C

IN C–

Inverting Input for Amplifier C

IN D+

Noninverting Input for Amplifier D

IN D–

Inverting Input for Amplifier D

—

No connection

OUT

—

Output

OUT A

Output for Amplifier A

OUT B

Output for Amplifier B

OUT C

Output for Amplifier C

OUT D

Output for Amplifier D

V+

Positive Supply

V–

Negative Supply

7 Specifications

7.1 Absolute Maximum Ratings

See

(1) (2)

MIN

MAX

UNIT

VIN differential

±300

Supply voltage (VS = V

+ – V−)

13.2

Voltage at input/output pins

V++ 0.3, V−

− 0.3

Input current

Junction temperature (3)

+150

°C

Infrared or convection (20 sec)

235

°C

Soldering information

Wave soldering lead temp. (10 sec)

260

°C

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

Electrostatic

V(ESD)

Charged-device model (CDM), per JEDEC specification JESD22-C101(3)

±1000

discharge

Machine Model (MM)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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