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INA129MDREP Datasheet(PDF) 4 Page - Texas Instruments |
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INA129MDREP Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 26 page ![]() NC V- IN V+ IN V- Ref V O V+ NC R G R G R G R G INA129-EP SBOS508A – DECEMBER 2009 – REVISED DECEMBER 2015 www.ti.com Bond Pad Coordinates in Mils DESCRIPTION PAD NUMBER a b c d NC 1 -57.4 -31.1 -53.3 -27 V-IN 2 -9.85 -31.4 -5.75 -27.3 V+IN 3 25.05 -31.4 29.15 -27.3 V- 4 56.2 -34.3 60.3 -30.2 Ref 5 53.75 -17.6 57.85 -11 VO 6 50.35 27.8 56.95 31.9 V+ 7 7.75 30.2 11.85 34.3 NC 8 -57.4 28.4 -53.3 32.5 RG (1) 9 -57.4 13.4 -53.3 20 RG (1) 10 -57.5 2.7 -53.4 9.3 RG (1) 11 -57.5 -7.9 -53.4 -1.3 RG (1) 12 -57.4 -18.6 -53.3 -12 (1) Pads 9 and 10 must both be bonded to a common point and correspond to package pin 8. Pads 11 and 12 must both be bonded to a common point and correspond to package pin 1. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: INA129-EP |
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