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TCS34907FN Datasheet(PDF) 27 Page - ams AG |
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TCS34907FN Datasheet(HTML) 27 Page - ams AG |
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27 / 34 page  ams Datasheet Page 27 [v1-09] 2016-Jan-11 Document Feedback TCS3490 − Soldering & Storage Information The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 37: Solder Reflow Profile Figure 38: Solder Reflow Profile Graph Parameter Reference Device Average temperature gradient in preheating 2.5 ºC/s Soak time tsoak 2 to 3 minutes Time above 217 ºC (T1)t1 Max 60 s Time above 230 ºC (T2)t2 Max 50 s Time above Tpeak - 10 ºC (T3)t3 Max 10 s Peak temperature in reflow Tpeak 260 ºC Temperature gradient in cooling Max -5 ºC/s Soldering & Storage Information Not to Scale Tpeak Time in seconds t2 T2 T3 T1 t3 |
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