DESD1LIN2WSQ

Document number: DS37406 Rev. 1 - 2

2 of 5

www.diodes.com

November 2014

© Diodes Incorporated

DESD1LIN2WSQ

Characteristic

Symbol

Value

Unit

Conditions

Peak Pulse Power Dissipation

160

W

8/20µs, Per Figure 1

Peak Pulse Current

3.0

A

8/20µs, Per Figure 1

ESD Protection

– Contact Discharge

±30

kV

Standard IEC 61000-4-2

ESD Protection

– Air Discharge

±30

kV

Standard IEC 61000-4-2

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Package Power Dissipation (Note 6)

250

mW

Thermal Resistance, Junction to Ambient (Note 6)

500

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Conditions

Reverse Standoff Voltage, from Pin 1 to Pin 2

-

-

15

V

-

Reverse Standoff Voltage, from Pin 2 to Pin 1

-

-

24

V

-

Channel Leakage Current, from Pin 1 to Pin 2

(Note 7)

-

1

50

nA

Channel Leakage Current, from Pin 2 to Pin 1

(Note 7)

-

1

50

nA

Breakdown Voltage, from Pin 1 to Pin 2

17.1

18.9

20.3

V

Breakdown Voltage, from Pin 1 to Pin 1

25.4

27.8

30.3

V

Clamping Voltage, from Pin 1 to Pin 2

-



-

25

V

-



-

35

V

Clamping Voltage, from Pin 2 to Pin 1

-



-

40

V

-



-

50

V

Differential Resistance

-



0.5

-

Ω

Channel Input Capacitance

-

13

17

pF

Notes:

6. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at

http://www.diodes.com.

7. Short duration pulse test used to minimize self-heating effect.

80

40

20

0

t, TIME (µs)

Figure 1 Pulse Waveform

100

50

0

t = 8µs

r

Peak Value I

PP

Half Value I

8x20 Waveform

as defined by R.E.A.

-10

0

10

20 30

40

50

60

70

80

90 100

TIME (ns)

Figure 2 ESD Discharge Current Wave Form

IEC 6100-4-2 (330 /150pF)



Rise time = 0.7ns to 1ns

0

20

40

60

80

100

120

27

53