USB4624 datasheet(18/58 Pages) MICROCHIP

18 / 58 page

USB 2.0 HSIC Hi-Speed 4-Port Hub Controller

Datasheet

DS00001717A-page 18

 2014 Microchip Technology Inc.

Note 3.2

When the device is configured to enable the HSIC upstream port, the USB Product ID

(PID) will be 4624. When the device is configured to enable the USB upstream port, the

USB PID will be 4524.

Note 3.3

Configuration strap values are latched on Power-On Reset (POR) and the rising edge of

RESET_N (external chip reset). Configuration straps are identified by an underlined

symbol name. Signals that function as configuration straps must be augmented with an

external resistor when connected to a load. Refer to Section 6.3, "Device Configuration

Straps," on page 30 for additional information.

+3.3V Power

Supply

VDD33

+3.3V power supply. These pins must be

connected to VDDA33. Refer to Chapter 4,

"Power Connections," on page 21 for power

connection information.

+1.8-3.3V

Core Power

Supply Input

VDDCOREREG

+1.8-3.3V core power supply input to internal

+1.2V regulator. This pin may be connected to

VDD33 for single supply applications when VBAT

equals +3.3V. Running in a dual supply

configuration with VDDCOREREG at a lower

voltage, such as +1.8V, may reduce overall

system power consumption. In dual supply

configurations, a 4.7

μF (<1

Ω ESR) capacitor to

ground is required for regulator stability. The

capacitor should be placed as close as possible

to the device. Refer to Chapter 4, "Power

Connections," on page 21 for power connection

information.

+1.2V Core

Power Supply

VDDCR12

+1.2V core power supply. In single supply

applications or dual supply applications where

1.2V is not used, a 1.0

μF (<1

Ω ESR) capacitor

to ground is required for regulator stability. The

capacitor should be placed as close as possible

to the device. Refer to Chapter 4, "Power

Connections," on page 21 for power connection

information.

+1.2V HSIC

Power Supply

Input

VDD12

+1.2V HSIC power supply input. Refer to

Chapter 4, "Power Connections," on page 21 for

power connection information.

Exposed

Pad on

package

bottom

(Figure 3.1)

Ground

VSS

Common ground. This exposed pad must be

connected to the ground plane with a via array.

Table 3.1 Pin Descriptions (continued)

NUM PINS

NAME

SYMBOL

BUFFER

TYPE

DESCRIPTION

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