1

2

3

4

USB–

MHL–

9

SEL

VCC

D+

OE

LEGEND

VIA to Power Plane

VIA to GND Plane

Polygonal Copper Pour

8

7

6

Bypass Capacitor

V+

5

D–

10

MHL+

GND

USB+

To Microcontroller

To Microcontroller

To USB connector

USB port

MHL port

Signal 1

GND Plane

Power Plane

Signal 2

TS3USB3000

SCDS337B – DECEMBER 2012 – REVISED DECEMBER 2015

www.ti.com

Layout Guidelines (continued)

Due to high frequencies associated with the USB, a printed circuit board with at least four layers is

recommended; two signal layers separated by a ground and power layer as shown in Figure 34.

Figure 34. Four-Layer Board Stack-Up

The majority of signal traces must run on a single layer, preferably Signal 1. Immediately next to this layer should

be the GND plane, which is solid with no cuts. Avoid running signal traces across a split in the ground or power

plane. When running across split planes is unavoidable, sufficient decoupling must be used. Minimizing the

number of signal vias reduces EMI by reducing inductance at high frequencies.

11.2 Layout Example

Figure 35. Package Layout Diagram

18

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