111

111

300

200

100

A max.

B

D

C

E

Time (s)

F max.

Pre-heating

Room

temperature

1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the

PC board’s temperature greatly differs from that of the switch, depending on the PC board’s material, size, thickness, etc.

The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly

recommended.

Notes

Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA（K）or CC（T）at soldering portion（copper foil surface）.

A heat resisting tape should be used for fixed measurement.

3. Temperature profile

Slide Switches Soldering Conditions

SSSS8

SSSS7

SSAC

Soldering temperature

Duration of immersion

Preheating temperature

Preheating time

SSAH, SSAG, SSAJ, SSAL

SSSS9

SSSS2

SSSF, SSSU

Series

Series

3+1/0s

4s max.

3s max.

3s max.

3s max.

3s max.

2s max.

Items

Soldering time

Dip soldering

SSSS9

SSSS2

120℃ max.

100℃ max.

100℃ max.

100℃ max.

60s max.

60s max.

60s max.

60s max.

260±5℃

260±5℃

5+0/-1s（2 times）

3±1s

SSSF, SSSU

260±5℃

10±1s/5±1s

SSAC

260±5℃

5±1s

Reference for Hand Soldering

Reference for Dip Soldering

(For PC board terminal types)

330±5℃

320±5℃

300±10℃

350±10℃

350±10℃

350±10℃

350±5℃

Soldering temperature

SSSS2

Vertical

1-pole, 3-position

Vertical

1-pole, 2-position

Horizontal

1-pole, 2-position

1-pole, 3-position

2-pole, 3-position

SSSS7

SSAH, SSAG, SSAJ, SSAL, SSSS8

260

150

Series（Reflow type）

260

250

230

40

180

120

A（℃）

3s max.

B（℃）

C（s）

D（℃）

E（℃）

F（s）