LSF0204, LSF0204D

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SLVSCP5D – JULY 2014 – REVISED DECEMBER 2015

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.5

7

V

–0.5

7

V

Continuous channel current

128

mA

Input clamp current

VI < 0

–50

mA

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and input/output negative-voltage ratings may be exceeded if the input and input/output clamp-current ratings are observed.

8.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input/output voltage

0

5

V

Reference voltage

0

5

V

Pass transistor current

64

mA

Operating free-air temperature

–40

125

°C

8.4 Thermal Information

LSF0204

RGY (VQFN)

RUT (UQFN)

PW (TSSOP)

UNIT

14 PINS

12 PINS

14 PINS

Junction-to-ambient thermal resistance

83.2

195.8

157.9

°C

Junction-to-case (top) thermal resistance

98.2

98.7

82.3

°C

Junction-to-board thermal resistance

59.2

122.6

100.0

°C

Junction-to-top characterization parameter

17.4

6.2

22.9

°C

Junction-to-board characterization parameter

59.4

122.6

99.0

°C

Junction-to-case (bottom) thermal resistance

38.7

N/A

N/A

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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