A

GND

DNU

V

CC

Y

C2

C1

B1

B2

A1

A2

A

N.C.

N.C.

6

5

4

2

3

GND

Y

V

CC

1

N.C.

GND

A

V

CC

Y

N.C.

6

5

4

2

3

1

SN74LVC1GU04

SCES215W – APRIL 1999 – REVISED JANUARY 2016

www.ti.com

DSF Package

6-Pin SON

DRY Package

Top View

6-Pin SON

Top View

YZP Package

6-Pin DSBGA

Top View

DNU – Do not use

PIN

I/O

DESCRIPTION

NAME

SON

DSBGA

A

2

B1

I

Input

GND

3

C1

—

Ground

NC

1, 5

A1, B2

—

Not connected

6

A2

—

Power pin

Y

4

C2

O

Output

(1)

N.C. – No internal connection

(2)

See Mechanical, Packaging, and Orderable Information for dimensions

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.5

6.5

V

0.5

6.5

V

–0.5

V

Input clamp current

–50

mA

Output clamp current

–50

mA

Continuous output current

±50

mA

±100

mA

Maximum junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-C101

±1000

4

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