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TS51221 Datasheet(PDF) 12 Page - Semtech Corporation |
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TS51221 Datasheet(HTML) 12 Page - Semtech Corporation |
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12 / 18 page  TS51221 Final Datasheet Rev 1.1 April 6, 2015 www.semtech.com 12 of 18 Semtech PCB Layout ForproperoperationandminimumEMI,caremustbetaken duringPCBlayout.Animproperlayoutcanleadtoissuessuch aspoorstabilityandregulation,noisesensitivityandincreased EMIradiation.(figure23)Themainguidelinesarethefollowing: • providelowinductiveandresistivepathsforloopswith highdi/dt, • providelowcapacitivepathswithrespecttoalltheother nodesfortraceswithhighdi/dt, • sensitivenodesnotassignedtopowertransmissionshould bereferencedtotheanalogsignalground(GND)andbe alwaysseparatedfromthepowerground(PGND). ThenegativeendsofCBYPASS,COUTandtheSchottkydiode DCATCH(optional)shouldbeplacedclosetoeachotherand connectedusingawidetrace.Viasmustbeusedtoconnect thePGNDnodetothegroundplane.ThePGNDnodemustbe placedascloseaspossibletotheTS51221PGNDpinstoavoid additionalvoltagedropintraces. ThebypasscapacitorCBYPASS(optionallyparalleledtoa0.1µF capacitor)mustbeplacedclosetotheVCCpinsofTS51221. TheinductormustbeplacedclosetotheVSWpinsand connecteddirectlytoCOUTinordertominimizethearea betweentheVSWpin,theinductor,theCOUTcapacitorandthe PGNDpins.Thetraceareaandlengthoftheswitchingnodes VSWandBSTshouldbeminimized. FortheadjustableoutputvoltageversionoftheTS51221, feedbackresistorsRBOTandRTOParerequiredforVoutsettings greaterthan0.9VandshouldbeplacedclosetotheTS51221 inordertokeepthetracesofthesensitivenodeFBasshort aspossibleandawayfromswitchingsignals.RBOTshouldbe connectedtotheanaloggroundpin(GND)directlyandshould neverbeconnectedtothegroundplane.Theanalogground trace(GND)shouldbeconnectedinonlyonepointtothe powerground(PGND).Agoodconnectionpointisunderthe TS51221packagetotheexposedthermalpadandviaswhich areconnectedtoPGND.RBOTwillbeconnectedtotheVOUT nodeusingatracethatendsclosetotheactualload. ForfixedoutputvoltageversionsoftheTS51221,RBOTandRTOP arenotrequiredandtheFBpinshouldbeconnecteddirectlyto theVOUT. TheexposedthermalpadmustbesolderedtothePCBfor mechanicalreliabilityandtoachievegoodpowerdissipation. Viasmustbeplacedunderthepadtotransfertheheattothe groundplane. Figure 1: TS51221 Application Schematic Typical Application Schematic |
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