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HMC311LP3 Datasheet(PDF) 6 Page - Hittite Microwave Corporation |
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HMC311LP3 Datasheet(HTML) 6 Page - Hittite Microwave Corporation |
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6 / 6 page ![]() MICROWAVE CORPORATION 8 - 67 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 8 HMC311LP3 v01.0604 InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6.0 GHz Evaluation PCB The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of VIA holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation cir- cuit board shown is available from Hittite upon request. List of Materials Item Description J1 - J2 PC Mount SMA Connector J3 2 mm DC Header C1, C2 Capacitor, 0402 Pkg. C3 10,000 pF Capacitor, 0805 Pkg. R1 22 Ohm Resistor, 0805 Pkg. L1 Inductor, 0805 Pkg. U1 HMC311LP3 PCB* 106493 Evaluation PCB * Circuit Board Material: Rogers 4350 Pin Number Description 1, 2, 3 Vs 4, 5, 6 GND J3 |
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