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CMS04 Datasheet(PDF) 4 Page - Toshiba Semiconductor |
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CMS04 Datasheet(HTML) 4 Page - Toshiba Semiconductor |
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4 / 5 page ![]() CMS04 2013-11-01 4 0.5 0.001 0.01 0.1 1 10 100 1000 1 10 100 500 Device mounted on a glass-epoxy board Soldering land: 2.1 mm × 1.4 mm Device mounted on a glass-epoxy board Soldering land: 6.0 mm × 6.0 mm Device mounted on a ceramic board Soldering land: 2.0 mm × 2.0 mm 0.1 0 20 40 60 80 100 120 160 1 100 1000 140 10 Pulse test 20 V VR = 30 V 15 V 10 V 5 V VR = 3 V 100 1 10 100 300 500 1000 f = 1 MHz Ta = 25°C 3 5 30 50 Reverse voltage VR (V) Cj –VR (typ.) Number of cycles Surge forward current (non-repetitive) Junction temperature Tj (°C) IR – Tj (typ.) Reverse voltage VR (V) PR (AV) – VR (typ.) rth (j-a) – t Time (s) 0 1 10 100 60 80 100 35 30 50 f = 50 MHz Ta = 25°C 40 20 4 8 12 16 0 0 10 20 30 24 28 20 DC 300° 240° 180° 120° 60° 360° Conduction angle: α Tj = 125°C VR 0° Rectangular waveform α |
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