PIC16F877ATISLASHML datasheet(177/234 Pages) MICROCHIP

177 / 234 page

 2003 Microchip Technology Inc.

DS39582B-page 175

PIC16F87XA

17.1

DC Characteristics:

PIC16F873A/874A/876A/877A (Industrial, Extended)

PIC16LF873A/874A/876A/877A (Industrial)

PIC16LF873A/874A/ 876A/877A

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

PIC16F873A/874A/876A/877A

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

-40°C

≤ TA ≤ +125°C for extended

Param

No.

Symbol

Characteristic/

Device

Min

Typ†

Max

Units

Conditions

VDD

Supply Voltage

D001

16LF87XA

2.0

—

5.5

All configurations

(DC to 10 MHz)

D001

16F87XA

4.0

—

5.5

All configurations

D001A

VBOR

5.5

BOR enabled, FMAX = 14 MHz(7)

D002

VDR

RAM Data Retention

Voltage(1)

—1.5

—

D003

VPOR

VDD Start Voltage to

ensure internal Power-on

Reset signal

—VSS

—V

See Section 14.5 “Power-on

Reset (POR)” for details

D004

SVDD

VDD Rise Rate to ensure

internal Power-on Reset

signal

0.05

—

V/ms

See Section 14.5 “Power-on

Reset (POR)” for details

D005

VBOR

Brown-out Reset

Voltage

3.65

4.0

4.35

BODEN bit in configuration word

enabled

Legend: Rows with standard voltage device data only are shaded for improved readability.

† Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1:

This is the limit to which VDD can be lowered without losing RAM data.

The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O

pin loading, switching rate, oscillator type, internal code execution pattern and temperature, also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is

measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS.

For RC osc configuration, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in k

Ω.

Timer1 oscillator (when enabled) adds approximately 20

µA to the specification. This value is from

characterization and is for design guidance only. This is not tested.

The

∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.

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