DIM750ASM65-TS000

2/8

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.

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ABSOLUTE MAXIMUM RATINGS

Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In

extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.

Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect

device reliability.

Symbol

Parameter

Test Conditions

Max.

Units

Collector-emitter voltage

6500

V

6500

V

6000

V

Gate-emitter voltage

±20

V

Continuous collector current

750

A

Peak collector current

1500

A

Max. transistor power dissipation

10

kW

I

Diode I

200

kA

Isolation voltage

– per module

Commoned terminals to base plate.

AC RMS, 1 min, 50Hz

10.2

kV

Partial discharge

– per module

10

pC

THERMAL AND MECHANICAL RATINGS

Internal insulation material:

AlN

Baseplate material:

AlSiC

Creepage distance:

56mm

Clearance:

26mm

CTI (Comparative Tracking Index):

>600

Symbol

Parameter

Test Conditions

Min

Typ.

Max

Units

Thermal resistance

– transistor

Continuous dissipation

–

junction to case

10

°C/kW

Thermal resistance

– diode

Continuous dissipation

–

junction to case

20

°C/kW

Thermal resistance

– case to heatsink

Mounting torque 5Nm

(with mounting grease)

6

°C/kW

Junction temperature

Transistor

125

°C

Diode

125

°C

Storage temperature range

-40

125

°C

Screw torque

Mounting

– M6

5

Nm

Electrical connections

– M4

2

Nm

Electrical connections

– M8

10

Nm