January 2002

3

MIC5239

MIC5239

Micrel

Supply Voltage (V

Enable Input Voltage (V

Power Dissipation (P

Junction Temperature (T

Storage Temperature (T

Lead Temperature (soldering, 5 sec.) ....................... 260

°C

ESD Rating, Note 4

Supply Voltage (V

Enable Input Voltage (V

Junction Temperature (T

Package Thermal Resistance

MSOP

(θ

SOT-223

(θ

Electrical Characteristics

V

Symbol

Parameter

Conditions

Min

Typ

Max

Units

V

OUT

Output Voltage Accuracy

variation from nominal V

OUT

–11

%

–2+2

%

∆V

Line Regulation

V

0.06

0.5

%

∆V

Load Regulation

I

0.5

1

%

∆V

Dropout Voltage, Note 6

I

mV

I

260

350

mV

400

mV

I

350

mV

I

GND

Ground Pin Current

V

40

µA

45

µA

V

1.3

5

mA

V

8.5

15

mA

I

GND(SHDN)

Ground Pin in Shutdown

V

0.1

1

µA

I

SC

Short Circuit Current

V

850

1200

mA

e

n

Output Noise

10Hz to 100kHz, V

µVrms

FLAG Output

V

FLG

Low Threshold

% of V

OUT

94

%

High Threshold

% of V

OUT

95

%

V

OL

FLAG Output Low Voltage

V

mV

I

LEAK

FLAG Output Leakage

V

0.1

µA

Enable Input

V

IL

Input Low Voltage

regulator off

0.6

V

V

IH

Input High Voltage

regulator on

2.0

V

I

IN

Enable Input Current

V

–1.0

0.01

1.0

µA

–2.0

2.0

µA

V

0.15

1.0

µA

2.0

µA

V

0.5

2.5

µA

5.0

µA

Note 1.

Exceeding the absolute maximum rating may damage the device.

Note 2.

The device is not guaranteed to function outside its operating rating.

Note 3:

The maximum allowable power dissipation of any T

allowable power dissipation will result in excessive die termperature, and the regulator will go into thermal shutdown. The

θ

x.xBMM (all versions) is 80

°C/W, the MIC5239-x.xBM (all versions) is 63°C/W, and the MIC5239-x.xBS (all versions) is 50°C/W mounted on a

PC board (see “Thermal Characteristics” for further details).