TLV2374IPW datasheet(17/28 Pages) TI

17 / 28 page

TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375

FAMILY OF 550 µA/Ch 3MHz RAILTORAIL INPUT/OUTPUT

OPERATIONAL AMPLIFIERS WITH SHUTDOWN

SLOS270C − MARCH 2001 − REVISED DECEMBER 2003

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POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251−1443

APPLICATION INFORMATION

general power dissipation considerations

For a given

θJA, the maximum power dissipation is shown in Figure 37 and is calculated by the following formula:

D +

MAX

–T

Where:

= Maximum power dissipation of TLV237x IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case

θCA = Thermal coefficient from case to ambient air (°C/W)

0.75

0.5

−55 −40 −25 −10 5

1.25

1.5

MAXIMUM POWER DISSIPATION

FREE-AIR TEMPERATURE

1.75

20 35 50

0.25

TA − Free-Air Temperature − °C

65 80 95 110 125

MSOP Package

Low-K Test PCB

θJA = 260°C/W

TJ = 150°C

PDIP Package

Low-K Test PCB

θJA = 104°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

SOT-23 Package

Low-K Test PCB

θJA = 324°C/W

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 37. Maximum Power Dissipation vs Free-Air Temperature

TLV2374IPW Datasheet(PDF) 17 Page - Texas Instruments

TLV2374IPW Datasheet(HTML) 17 Page - Texas Instruments

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