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FEATURES

DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

CLK

D

Q

GND

PRE

CLR

Q

4

3

2

1

5

6

7

8

GND

Q

D

CLK

Q

CLR

PRE

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G74

SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

WITH CLEAR AND PRESET

SCES203K – APRIL 1999 – REVISED JUNE 2005

•

Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

•

•

Inputs Accept Voltages to 5.5 V

•

•

Low Power Consumption, 10-

µA Max I

CC

•

±24-mA Output Drive at 3.3 V

•

•

•

Operation

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™

SN74LVC2G74YEAR

WCSP (DSBGA) – YEA

NanoFree™

SN74LVC2G74YZAR

WCSP (DSBGA) – YZA (Pb-free)

Reel of 3000

_ _ _CP_

NanoStar™ – WCSP (DSBGA)

SN74LVC2G74YEPR

0.23-mm Large Bump – YEP

–40°C to 85°C

NanoFree™ – WCSP (DSBGA)

SN74LVC2G74YZPR

0.23-mm Large Bump – YZP (Pb-free)

SSOP – DCT

Reel of 3000

SN74LVC2G74DCTR

C74_ _ _

Reel of 3000

SN74LVC2G74DCUR

VSSOP – DCU

C74_

Reel of 250

SN74LVC2G74DCUT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1999–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.