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BSH108 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BSH108
Description  N-channel enhancement mode field-effect transistor
PDF  13 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BSH108 Datasheet(HTML) 2 Page - NXP Semiconductors

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Philips Semiconductors
BSH108
N-channel enhancement mode field-effect transistor
Product specification
Rev. 02 — 25 October 2000
2 of 13
9397 750 07652
© Philips Electronics N.V. 2000. All rights reserved.
5.
Quick reference data
6.
Limiting values
Table 2:
Quick reference data
Symbol Parameter
Conditions
Typ
Max
Unit
VDS
drain-source voltage (DC)
Tj =25to150 °C
−
30
V
ID
drain current (DC)
Tsp =25 °C; VGS =5V
−
1.9
A
Ptot
total power dissipation
Tsp =25 °C
−
0.83
W
Tj
junction temperature
−
150
°C
RDSon
drain-source on-state resistance
VGS = 10 V; ID = 1 A
77
120
m
Ω
VGS =5V; ID = 1 A
102
140
m
Ω
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
Tj =25to150 °C
−
30
V
VDGR
drain-gate voltage (DC)
Tj =25to150 °C; RGS =20kΩ−
30
V
VGS
gate-source voltage (DC)
−±20
V
ID
drain current (DC)
Tsp =25 °C; VGS =5V; Figure 2 and 3
−
1.9
A
Tsp = 100 °C; VGS =5V; Figure 2
−
1.2
A
IDM
peak drain current
Tsp =25 °C; pulsed; tp ≤ 10 µs; Figure 3
−
7.5
A
Ptot
total power dissipation
Tsp =25 °C; Figure 1
−
0.83
W
Tstg
storage temperature
−65
+150
°C
Tj
operating junction temperature
−65
+150
°C
Source-drain diode
IS
source (diode forward) current (DC)
Tsp =25 °C
−
0.83
A
ISM
peak source (diode forward) current Tsp =25 °C; pulsed; tp ≤ 10 µs
−
3.3
A



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