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ADC32RF80IRMPR Datasheet(PDF) 6 Page - Texas Instruments |
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ADC32RF80IRMPR Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 8 page  www.ti.com EXAMPLE BOARD LAYOUT 72X (0.6) 72X (0.24) ( 8.5) (9.8) 68X (0.5) (0.25) TYP 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND ( ) TYP VIA 0.2 (9.8) (1.315) TYP (1.315) TYP 4221047/B 02/2014 VQFN - 0.9 mm max height RMP0072A VQFN SYMM SYMM SEE DETAILS LAND PATTERN EXAMPLE SCALE:8X 1 18 19 36 37 54 55 72 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271). METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING METAL SOLDER MASK DEFINED |
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