LM3535TMXSLASHNOPB datasheet(3/34 Pages) TI1

3 / 34 page

LM3535

www.ti.com

SNVS598A – AUGUST 2010 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2) (3)

VIN pin voltage

-0.3V to 6.0V

SCL, SDIO, HWEN, PWM pin voltages

-0.3V to (VIN+0.3V)

w/ 6.0V max

IDxx Pin Voltages

-0.3V to (VVOUT+0.3V)

w/ 6.0V max

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJ-MAX)

150°C

Storage Temperature Range

-65°C to +150° C

Maximum Lead Temperature (Soldering)

See(5)

ESD Rating

Human Body Model(6)

2.0kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 125°C (typ.).

(5)

For detailed soldering specifications and information, please refer to Application Note 1112 (SNVA009): DSBGA Wafer Level Chip Scale

Package.

(6)

The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Operating Rating

(1) (2)

Input Voltage Range

2.7V to 5.5V

LED Voltage Range

2.0V to 4.0V

Junction Temperature (TJ) Range

-30°C to +110°C

Ambient Temperature (TA) Range

(3)

-30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

110°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal Resistance (

θJA),

40°C/W

DSBGA Package(1)

(1)

Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to

Application Note AN-1112 (SNVA009): DSBGA Wafer Level Chip Scale Package.

Submit Documentation Feedback

Product Folder Links: LM3535

LM3535TMX/NOPB Datasheet(PDF) 3 Page - Texas Instruments

LM3535TMX/NOPB Datasheet(HTML) 3 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

Datasheet Download

Link URL