| Electronic Components Datasheet Search |
|
LMH6504MA/NOPB Datasheet(PDF) 2 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
LMH6504MA/NOPB Datasheet(HTML) 2 Page - Texas Instruments |
|
2 / 29 page ![]() LMH6504 SNOSA96D – NOVEMBER 2003 – REVISED MARCH 2013 www.ti.com DESCRIPTION CONTINUED LMH6504 gain control is linear in dB for a large portion of the total gain control range. This makes the device suitable for AGC applications. For linear gain control applications, see the LMH6503 data sheet. The combination of minimal external components and small outline packages (SOIC and VSSOP) allows the LMH6504 to be used in space-constrained applications. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) ESD Tolerance (2): Human Body Model 1000V Machine Model 100V Input Current ±10 mA Output Current 120 mA (3) Supply Voltages (V+ - V−) 12.6V Voltage at Input/ Output pins V+ +0.8V, V− −0.8V Storage Temperature Range −65°C to 150°C Junction Temperature 150°C Soldering Information: Infrared or Convection (20 sec) 235°C Wave Soldering (10 sec) 260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical Characteristics. (2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (3) The maximum output current (IOUT) is determined by device power dissipation limitations or value specified, whichever is lower. Operating Ratings Supply Voltages (V+ - V−) 7V to 12V Temperature Range (1) −40°C to +85°C Thermal Resistance: ( θJC) ( θJA) 8-Pin SOIC 60 165 8-Pin VSSOP 65 235 (1) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMH6504 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |