BM78 datasheet(43/60 Pages) MICROCHIP

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 2016 Microchip Technology Inc.

Advance Information

DS60001380A-Page 43

BM78

7.0

REFLOW PROFILE

The BM78 should be assembled using a standard

lead-free reflow profile, IPC/JEDEC J-STD-020. The

BM78 can be soldered to the host PCB by using the

standard leaded and lead-free solder reflow profile.

To avoid damage to the module, follow these recom-

mendations:

• Follow solder reflow recommendations provided

in Microchip Technology Application Note “AN233

Solder Reflow Recommendation (DS00233)”.

• Refer to the solder paste data sheet for specific

reflow profile recommendations.

• Do not exceed the peak temperature (TP) of

250ºC.

• Use no-clean flux solder paste.

• Do not wash as moisture can be trapped under

the shield.

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.

• Standard: IPC/JEDEC J-STD-020.

- Condition: Preheat:150~200

℃ for 60~120

seconds.

- Average ramp-up rate (217

℃ to peak): 3 ℃

sec max.

- Temperature maintained above 217: 60~150

seconds.

-Time within 5

℃ of peak temperature: 30 ~ 40

seconds.

- Peak temperature: 260 +5/-0

℃ .

- Ramp-down rate (peak to 217): 6

℃ /sec.

max.

- Time 25

℃ to peak temperature: 8 minutes

max.

- Cycle interval 5 minutes.

FIGURE 7-1:

REFLOW PROFILE

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