SOLDERABLE ENDS

D2

D2=D1

＋0

－0.20

0.5± 0.1

0.5± 0.1

4.9± 0.2

FEATURES

◇

Plastic package has underwriters laboratories

flammability classification 94V-0

◇

Glass passivated chip junction

◇

For surface mount applications

◇

High temperature metallurgically bonded construction

MECHANICAL DATA

◇

Case: JEDEC DO-213AB,molded plastic

◇

Terminals: Axial lead ,solderable per

MIL- STD-750,Method 2026

◇

Polarity: Color band denotes cathode

◇

Weight: 0.0046 ounces, 0.116 grams

◇

Mounting position: Any

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25℃ ambient temperature unless otherwise specified.

Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate current by 20%.

GL

41B

GL

41D

GL

41G

GL

41J

GL

41K

GL

41M

GL

41T

GL

41Y

UNITS

Maximum recurrent peak reverse voltage

100 200 400 600 800 1000 1300 1600

V

Maximum RMS voltage

70

140 280 420 560 700 910 1120

V

Maximum DC blocking voltage

100 200 400 600 800 1000 1300 1600

V

Maximum average forward rectified current

(see FIG.1)

Peak forward surge current

8.3ms single half-sine-wave

superimposed on rated load (JEDEC Method)

Maximum instantaneous forward voltage

@1.0A

V

Maximum reverse current

Typical junction capacitance (Note1)

pF

Typical thermal resistance (Note 2)

℃

/W

Operating junction temperature range

℃

Storage temperature range

℃

NOTE: 1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.

2. Thermal resistance from junction to ambient, 0.24×0.24"(6.0×6.0mm) copper pads to each terminal.

50

8.0

75

- 55 ---- +175

- 55 ---- +175

1.0

30

1.2

10

GL41A---GL41

Y

◇

High temperature soldering guaranteed:450 ℃/5

DO - 213AB

1.1

VOLTAGE RANGE

: 50 --- 1000 V

CURRENT: 1.0 A

seconds at terminals.Complete device sub-mersible

◇

Cavity-free glass passivated junction

SURFACE MOUNT

RECTIFIER

S

temperature of 265℃ for 10 seconds in solder bath

GL

41A

50

50

35

A

µA

A

Dimensions in millimeters

Diode Semiconductor Korea

www.diode.kr