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ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATINGS

(1)

THERMAL CHARACTERISTICS

TLK2201B

TLK2201BI

SLLS585C – NOVEMBER 2003 – REVISED FEBRUARY 2008

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

–0.3 to 3

V

Input voltage range at TTL terminals

–0.5 to 4

V

Input voltage range at any other terminal

V

Storage temperature

–65 to 150

°C

CDM

1

kV

Electrostatic discharge

HDM

2

kV

TLK2201B

0 to 70

°C

Characterized free-air operating temperature range

TLK2201BI

–40 to 85

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

OPERATING

TA = 70

°C

PACKAGE

POWER RATING

POWER RATING

5.25 W

46.58 mW/

°C

2.89 W

3.17 W

23.70 mW/

°C

1.74 W

2.01 W

13.19 mW/

°C

1.11 W

(1)

For more information, refer to TI application note PowerPAD Thermally Enhanced Package

(SLMA002).

(2)

(3)

2 oz. Trace and copper pad with solder.

(4)

2 oz. Trace and copper pad without solder.

(5)

Standard JEDEC high-K board

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased

21.47

to thermal land

Junction-to-free-air thermal resistance

Board-mounted, no air flow, high conductivity TI

°C/W

recommended test board with thermal land but no

42.20

solder or grease thermal connection to thermal land

Board-mounted, no air flow, JEDEC test board

75.83

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased

0.38

to thermal land

Junction-to-case-thermal resistance

Board-mounted, no air flow, high conductivity TI

°C/W

recommended test board with thermal land but no

0.38

solder or grease thermal connection to thermal land

Board-mounted, no air flow, JEDEC test board

7.8

10

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