TLV2372IP datasheet(9/58 Pages) TI1

9 / 58 page

TLV2370, TLV2371, TLV2372

TLV2373, TLV2374, TLV2375

www.ti.com

SLOS270F – MARCH 2001 – REVISED AUGUST 2016

Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.3 Thermal Information: TLV2370

THERMAL METRIC(1)

TLV2370

UNIT

DBV (SOT-23)

D (SOIC)

P (PDIP)

6 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

228.5

138.4

49.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

99.1

89.5

39.4

°C/W

RθJB

Junction-to-board thermal resistance

54.6

78.6

26.4

°C/W

ψJT

Junction-to-top characterization parameter

7.7

29.9

15.4

°C/W

ψJB

Junction-to-board characterization parameter

53.8

78.1

26.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information: TLV2371

THERMAL METRIC(1)

TLV2371

UNIT

DBV (SOT-23)

D (SOIC)

P (PDIP)

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

228.5

138.4

49.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

99.1

89.5

39.4

°C/W

RθJB

Junction-to-board thermal resistance

54.6

78.6

26.4

°C/W

ψJT

Junction-to-top characterization parameter

7.7

29.9

15.4

°C/W

ψJB

Junction-to-board characterization parameter

53.8

78.1

26.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: TLV2372

THERMAL METRIC(1)

TLV2372

UNIT

D (SOIC)

DGK (VSSOP)

P (PDIP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

138.4

191.2

49.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

89.5

61.9

39.4

°C/W

RθJB

Junction-to-board thermal resistance

78.6

111.9

26.4

°C/W

ψJT

Junction-to-top characterization parameter

29.9

5.1

15.4

°C/W

ψJB

Junction-to-board characterization parameter

78.1

110.2

26.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

TLV2372IP Datasheet(PDF) 9 Page - Texas Instruments

TLV2372IP Datasheet(HTML) 9 Page - Texas Instruments

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