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TLV2471CDBVRG4 Datasheet(PDF) 32 Page - Texas Instruments

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Part # TLV2471CDBVRG4
Description  FAMILY OF 600muA/Ch 2.8MHz RAIL-TO-RAIL INPUT/OUTPUT HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN
PDF  64 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV2471CDBVRG4 Datasheet(HTML) 32 Page - Texas Instruments

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*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV2470AIDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2470CDBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
TLV2470CDBVT
SOT-23
DBV
6
250
180.0
180.0
18.0
TLV2470CDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2470IDBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
TLV2470IDBVT
SOT-23
DBV
6
250
180.0
180.0
18.0
TLV2470IDR
SOIC
D
8
2500
367.0
367.0
38.0
TLV2470IDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2471AIDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2471CDBVR
SOT-23
DBV
5
3000
182.0
182.0
20.0
TLV2471CDBVT
SOT-23
DBV
5
250
182.0
182.0
20.0
TLV2471CDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2471IDBVR
SOT-23
DBV
5
3000
182.0
182.0
20.0
TLV2471IDBVT
SOT-23
DBV
5
250
182.0
182.0
20.0
TLV2471IDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2472AIDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2472CDGNR
MSOP-PowerPAD
DGN
8
2500
358.0
335.0
35.0
TLV2472CDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2472IDGNR
MSOP-PowerPAD
DGN
8
2500
358.0
335.0
35.0
TLV2472IDR
SOIC
D
8
2500
340.5
338.1
20.6
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Feb-2016
Pack Materials-Page 3



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