TMP320C50KGD, TMP320LC50KGD

DIGITAL SIGNAL PROCESSOR

KNOWN GOOD DIE

SGZS008C -- JULY 1996 -- REVISED JUNE 2000

2

POST OFFICE BOX 1443

description (continued)

With the addition of the IDLE2 instruction, the ’C5x achieves low-power consumption. IDLE2 removes the

functional clock from the internal hardware of the ’C5x that puts it into a total-sleep mode using only 5 μA.

A low-logic level on an external interrupt with chip duration of at least five clock cycles ends the IDLE2 mode.

TMP PRODUCT FLOW; 40 AND 57 MHz

Multiprobe

dc test @ 25°C

Test conditions

Per commercial data sheet

DC test

Hot chuck probe @ 85°C

AC test

Hot chuck probe @ 85°C @ Speed

Visual

40x

Warranty

Datasheet upon shipment, 1 year

For electrical and timing specifications, see the TMS320C5x, TMS320LC5x Digital Signal Processors data

sheet (literature number SPRS030).

SPECIFIC DIE-RELATED INFORMATION

Die Size (approximate)

358 mils x 338 mils

Die Thickness

11 mils  1mil

Backside Surface Finish

SIO2

Die Backside Potential

Floating

Max Allowable Die Junction Operating Temperature

125°C

Glassivation Material and Thickness

3KAOX/9KACN

Recommended Packing

GEL PAK

Die Attach Information

SILVER GLASS

Suggested Bond Wire Size

1.25 AL

Suggested Bonding Method

WEDGE

ESD Sensitivity

Class II

Max Allowable Process Temperature for Die Attach

450°C