 2015 Microchip Technology Inc.

DS20005425A-page 13

HV5308 / HV5408

44-Lead PLCC Package Outline (PJ)

.653x.653in body, .180in height (max), .050in pitch

Symbol

A

A1

A2

b

b1

D

D1

E

E1

e

R

Dimension

(inches)

MIN

.165

.090

.062

.013

.026

.685

.650

.685

.650

.050

BSC

.025

NOM

.172

.105

-

-

-

.690

.653

.690

.653

.035

MAX

.180

.120

.083

.021

.695

.656

.695

.656

.045

JEDEC Registration MS-018, Variation AC, Issue A, June, 1993.

† This dimension differs from the JEDEC drawing.

Drawings not to scale.

.150 MAX

1

.075 MAX

6

40

D

D1

E1

E

Top View

Horizontal Side View

View B

A

A2

A1

Seating

Plane

e

b

Note 1

(Index Area)

.056/.042 x 45

O

.020max

(3 Places)

.020 MIN

Vertical Side View

View B

Note 2

44

b1

Base

Plane

R

Notes:

1.

a printed indicator.

2.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.