MCP1804_13 datasheet(33/36 Pages) MICROCHIP

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 2009-2013 Microchip Technology Inc.

DS20002200D-page 33

MCP1804

APPENDIX A: REVISION HISTORY

Revision D (October 2013)

The following is the list of modifications:

Added operating junction temperature range in

Temperature Specifications.

Updated

the

maximum

package

power

dissipation values in Section 6.3.1.2, Junction

Temperature Estimate.

Updated package specification drawings to

reflect all view.

Minor typographical changes.

Revision C (June 2011)

The following is the list of modifications:

Added seven new characterization graphs to

Section 2.0,

Typical

Performance

Curves

(Figures 2-49 - 2-55).

Changed layout of Table 3-1. Added separate

column for SOT-223-3.

Updated Package Marking drawings and

examples in the Packaging Information section.

Added

new

voltage

option

Product

Identification System table.

Revision B (November 2009)

The following is the list of modifications:

• Electrical characteristics, SHDN “H” Voltage item:

Changed to SHDN “L” Voltage.

Revision A (September 2009)

• Original Release of this Document.

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