MCP1700T-2502ESLASHMB datasheet(4/28 Pages) MICROCHIP

4 / 28 page

MCP1700

DS20001826C-page 4

 2005-2013 Microchip Technology Inc.

Output Noise

—3

—

µV/(Hz)1/2

IL = 100 mA, f = 1 kHz, COUT =1 µF

Power Supply

Ripple Rejection

Ratio

PSRR

—

f = 100 Hz, COUT =1 µF, IL =50 mA,

VINAC = 100 mV pk-pk, CIN =0 µF,

VR =1.2V

Thermal

Shutdown

Protection

TSD

—

140

—

°C

VIN =VR +1V, IL = 100 µA

TEMPERATURE SPECIFICATIONS

Electrical Characteristics: Unless otherwise specified, all limits are established for VIN =VR +1V, ILOAD = 100 µA,

COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.

Boldface type applies for junction temperatures, TJ (Note 1) of -40°C to +125°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

+125

°C

Operating Temperature Range

-40

+125

°C

Storage Temperature Range

-65

+150

°C

Thermal Package Resistance

Thermal Resistance, 2x2 DFN



—91—

°C/W

EIA/JEDEC® JESD51-7

FR-4 0.063 4-Layer Board



—19—

°C/W

Thermal Resistance, SOT-23



—

336

—

°C/W

EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer Board



—110

—

°C/W

Thermal Resistance, SOT-89



—

180

—

°C/W

EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer Board



—52—

°C/W

Thermal Resistance, TO-92



—

160

—

°C/W



—

66.3

—

°C/W

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power

dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

junction temperatures above 150°C can impact the device reliability.

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: Unless otherwise specified, all limits are established for VIN =VR +1V, ILOAD = 100 µA,

COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.

Boldface type applies for junction temperatures, TJ (Note 6) of -40°C to +125°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Note

The minimum VIN must meet two conditions: VIN  2.3V and VIN  VR +3.0% VDROPOUT.

VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V. The

input voltage VIN =VR + 1.0V; IOUT = 100 µA.

TCVOUT =(VOUT-HIGH -VOUT-LOW) *10

6 / (V

R * Temperature), VOUT-HIGH = highest voltage measured over the

temperature range. VOUT-LOW = lowest voltage measured over the temperature range.

Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCVOUT.

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

value with a VR + 1V differential applied.

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power

dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

junction temperatures above 150°C can impact the device reliability.

The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the

ambient temperature is not significant.

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