OPA551, OPA552

www.ti.com

SBOS100B – JULY 1999 – REVISED JANUARY 2016

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Links

Table 1 lists quick access links. Categories include technical documents, support and community resources,

tools and software, and quick access to sample or buy.

Table 1. Related Links

TECHNICAL

TOOLS &

SUPPORT &

PARTS

PRODUCT FOLDER

SAMPLE & BUY

DOCUMENTS

SOFTWARE

COMMUNITY

OPA551

Click here

Click here

Click here

Click here

Click here

OPA552

Click here

Click here

Click here

Click here

Click here

11.2.2 Related Documentation

For related documentation, please see the following:

•

Heat Sinking — TO-3 Thermal Mode (SBOA021)

•

Application bulletin AB-028: Feedback Plots Define Op Amp AC Performance (SBOA015)

•

Application bulletin AB-039: Power Amplifier Stress and Power Handling Limitations (SBOA022)

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

Copyright © 1999–2016, Texas Instruments Incorporated

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Product Folder Links: OPA551 OPA552