74LVC2G38

Document number: DS37930 Rev 1 - 2

5 of 11

www.diodes.com

September 2016

© Diodes Incorporated

74LVC2G38

Operating Characteristics

Parameter

Test

Conditions

Unit

Typ.

Typ.

Typ.

Typ.

Power Dissipation

Capacitance

f = 10MHz

6

7

7

9

pF

Package Characteristics

Symbol

Parameter

Package

Test Conditions

Min

Typ.

Max

Unit

θ

JA

Thermal Resistance Junction-

to-Ambient

X2-DFN2010-8

(Note 10)

—

313

—

°C/W

X2-DFN1410-8

—

321

—

X2-DFN1210-8

—

395

—

θ

JC

Thermal Resistance Junction-

to-Case

X2-DFN2010-8

(Note 10)

—

145

—

°C/W

X2-DFN1410-8

—

166

—

X2-DFN1210-8

—

236

—

Note:

10. Test condition for each package type: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

Switching Characteristics

Parameter

From

Input

To

Output

Unit

Min

Typ

Max

Min

Max

A or B

Y

1.8V ± 0.15V

1.2

3.0

8.6

1.2

10.8

ns

2.5V ± 0.2V

0.7

1.8

4.8

0.7

6.0

2.7V

0.7

2.5

4.4

0.7

5.5

3.3V ± 0.3V

0.7

2.1

4.1

0.7

5.2

5.0V ± 0.5V

0.5

1.5

3.3

0.5

4.2

A or B

Y

1.8V ± 0.15V

1.2

3.0

8.6

1.2

10.8

ns

2.5V ± 0.2V

0.7

1.8

4.8

0.7

6.0

2.7V

0.7

2.5

4.4

0.7

5.5

3.3V ± 0.3V

0.7

2.1

4.1

0.7

5.2

5.0V ± 0.5V

0.5

1.5

3.3

0.5

4.2