ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

TPS775xx, TPS776xx

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

(2)

TPS775xxyyyz, TPS776xxyyyz

XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).

YYY is package designator.

Z is package quantity.

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Custom fixed output voltages are available; minimum order quantities may apply. Contact factory for details and availability.

Over operating temperature range (unless otherwise noted)

(1)

PARAMETER

TPS775xx, TPS776xx

UNIT

(2)

–0.3 to +13.5

V

Voltage range at EN

–0.3 to +16.5

V

Maximum RESET voltage (TPS775xx)

16.5

V

Maximum PG voltage (TPS776xx)

16.5

V

Peak output current

Internally limited

Voltage range at OUT, FB

7

V

Continuous total power dissipation

See Dissipation Ratings Table

–40 to +125

°C

–65 to +150

°C

ESD rating, HBM

2

kV

(1)

Stresses above these ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended

periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other

conditions beyond those specified is not implied.

(2)

All voltages are with respect to network terminal ground.

AIRFLOW

DERATING FACTOR

BOARD

PACKAGE

(CFM)

0

568

5.68mW/°C

312

227

—

D

250

904

9.04mW/°C

497

362

0

2350

23.5mW/°C

1300

940

PWP

300

3460

34.6mW/°C

1900

1400

0

2380

23.8mW/°C

1300

952

PWP

300

5790

57.9mW/°C

3200

2300

(1)

This parameter is measured with the recommended copper heat sink pattern on a 1-layer, 5in × 5in printed circuit board (PCB), 1-ounce

(2)

This parameter is measured with the recommended copper heat sink pattern on a 8-layer, 1.5in × 2in PCB, 1-ounce copper with layers

SLMA002.

2

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