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MCP9902T-2E/RW Datasheet(PDF) 9 Page - Microchip Technology |
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MCP9902T-2E/RW Datasheet(HTML) 9 Page - Microchip Technology |
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9 / 50 page ![]() 2015-2016 Microchip Technology Inc. DS20005382C-page 9 MCP9902/3/4 4.0 FUNCTIONAL DESCRIPTION Thermal management is performed in cooperation with a host device. This consists of the host reading the temperature data of both the external and internal temperature diodes of the MCP9902/3/4 and using that data to control the speed of one or more fans. The MCP9902/3/4 has two levels of monitoring. The first provides a maskable ALERT signal to the host when the measured temperatures exceed user pro- grammable limits. This allows the MCP9902/3/4 to be used as an independent thermal watchdog to warn the host of temperature hot spots without direct control by the host. The second level of monitoring provides a non-maskable interrupt on the THERM output if the measured temperatures meet or exceed a second pro- grammable limit. Figure 4-1 shows a system level block diagram of the MCP9902/3/4. FIGURE 4-1: MCP9902/3/4 System Diagram. 4.1 Power States The MCP9902/3/4 has two modes of operation: • Active (Run) - In this mode of operation, the ADC is converting on all temperature channels at the programmed conversion rate. The temperature data is updated at the end of every conversion and the limits are checked. In Active mode, writing to the one-shot register will do nothing. • Standby (Stop) - In this mode of operation, the majority of circuitry is powered down to reduce supply current. The temperature data is not updated and the limits are not checked. In this mode of operation, the SMBus is fully active and the part will return requested data. Writing to the one-shot register will enable the device to update all temperature channels. Once all the channels are updated, the device will return to the Standby mode. 4.2 Conversion Rates The MCP9902/3/4 may be configured for different con- version rates based on the system requirements. The default conversion rate is 4 conversions per second. Other available conversion rates are shown in Table 4-1. 4.3 Dynamic Averaging Dynamic averaging allows the MCP9902/3/4 to measure the external diode channel for an extended time based on the selected conversion rate. This functionality can be disabled for increased power savings at the lower conversion rates (see Register 5-6). When dynamic averaging is enabled, the device will automatically adjust the sampling and measurement time for the external diode channels. This allows the device to average 2x or 16x longer than the normal 11 bit operation (nominally 21 ms per channel) while still maintaining the selected conversion rate. The benefits of dynamic averaging are improved noise rejection due to the longer integration time as well as less random variation of the temperature measurement. When enabled, the dynamic averaging applies when a one-shot command is issued. The device will perform the desired averaging during the one-shot operation according to the selected conversion rate. When enabled, the dynamic averaging will affect the typical supply current based on the chosen conversion rate as shown in the power supply characteristics in Table 1.2 "DC Characteristics" . CPU/GPU MCP990X Host DP1 DN1 SMDATA Thermal Junction SMCLK SMBus Interface THERM/ADDR ALERT Power Control VDD GND VDD = 3.3V 3.3V – 5V DN2/ DP3 DP2/ DN3 Optional Anti-parallel diode MCP9903/4 only TABLE 4-1: CONVERSION RATE CONV<3:0> Conversions/ Second HEX 3 210 0h 000 0 1/16 1h 000 1 1/8 2h 001 0 1/4 3h 001 1 1/2 4h 010 0 1 5h 010 1 2 6h 011 0 4 (default) 7h 011 1 8 8h 100 0 16 9h 100 1 32 Ah 101 0 64 Bh - Fh All others 1 |
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