■

■

■

■ 제품

제품

제품

제품 규격

규격

규격

규격

■

■

■

■ 부품별

부품별

부품별

부품별 적용

적용

적용

적용 원재료

원재료

원재료

원재료

※ Reflow최대 온도 250℃를 만족시킴으로 Lead-free Soldering의 요구조건에 적합한 제품임.

※ RoHS지침 및 유해 물질 관리 기준에 적합한 제품임.

7.Resistance to

Soldering heat

Reflow : 150~200℃ 60~180Sec ,

217℃ 60~150sec, Peak 255 ± 5℃ ,

Peak 5℃

No deformation of

components affecting performance.

METAL FITTING

Phosphor Bronze

Sn over Ni plating

-

SIGNAL CONTACT

Phosphor Bronze

Gold plating over Ni

Rating

Voltage 50V

- 55 ℃ ∼ ＋ 85 ℃

- 10 ℃ ∼ ＋ 50 ℃

Ni Barrier

CASE

LCP

NATURAL

UL94V-0

Part

Part

Part

Part

Material

Material

Material

Material

Finish

Finish

Finish

Finish

Remarks

Remarks

Remarks

Remarks

6.Moisture Resistance

Contact Resistance : 100m

Max

Insulation Resistance : 500M

Min

Duration : 96Hr

4.FFC Retention Force

Ver:1.2kgf MIN/Hor:1.8kgf MIN

Measure at 0.3±0.03mm FFC

Contact Resistance : 100m

Max

Temperature : 40±2℃

Relative Humidity : 90∼95%

5.Mechanical operation

20 Time insertions and extractions.

Current 0.5A

Operating temperature range

Storage temperature range

3.Contact Resistance

100m

Max

Measured at 1mA(or 1,000㎐)

2.Withstand voltage

Neither shot or insulation beakdown

150V AC for 1 minute

Measureed at 100V DC

Item

Specification

Conditions

1.Insulation Resistance

500MΩ Min

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HIROSE KOREA

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