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ICF Datasheet(PDF) 2 Page - Murata Power Solutions Inc. |
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ICF Datasheet(HTML) 2 Page - Murata Power Solutions Inc. |
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2 / 16 page ![]() www.murata-ps.com/support MDC_ICF_A01 Page 2 of 16 ICF Series Wide Input 1000 Watt Isolated Full Brick DC-DC Electrical Specifications – All Models Conditions: TA = 25 ºC, Airflow = 300 LFM (1.5 m/s), Vin = 24VDC, unless otherwise specified. Specifications are subject to change without notice. Parameter Notes Min Typ Max Units Absolute Maximum Ratings Input Voltage Continuous 0 40 V Transient (100ms) 50 V Operating Temperature (See Note 1) Baseplate (100% load) Standard model -40 105 °C Baseplate (100% load) “T” model -55 105 °C Storage Temperature -55 125 °C Isolation Characteristics and Safety Isolation Voltage Input to Output 2250 V Input to Baseplate & Output to Baseplate 1500 V Isolation Capacitance 9000 pF Isolation Resistance 10 20 MΩ Insulation Safety Rating Basic Designed to meet UL/cUL 60950, IEC/EN60950-1 Feature Characteristics Fixed Switching Frequency 200 kHz Input Current and Output Voltage Ripple 400 kHz Output Voltage Trim Range Adjustable via TRIM (Pin 12) -40 +10 % Remote Sense Compensation Between each SENSE input and its corresponding OUT pin 1 V Output Overvoltage Protection Non-latching 114 119 130 % Overtemperature Shutdown (Baseplate) Non-latching 110 115 120 °C Auto-Restart Period Applies to all protection features 1.7 2 2.3 s Turn-On Time from Vin Time from UVLO to Vo=90%VOUT(NOM) Resistive load 480 517 530 ms Turn-On Time from ON/OFF Control Time from ON to Vo=90%VOUT(NOM) Resistive load 15 22 30 ms Rise Time Vout from 10% to 90% 4 7.5 11 ms ON/OFF Control – Positive Logic ON state Pin open = ON or 2 12 V Control Current Leakage current 0.16 mA OFF state 0 0.8 V Control current Sinking 0.3 0.36 mA ON/OFF Control – Negative Logic ON state Pin shorted to – ON/OFF pin or 0 0.8 V OFF state Pin open = OFF or 2 12 V Thermal Characteristics Thermal resistance Baseplate to Ambient Converter soldered to 5” x 3.5” x 0.07”, 4 layer/2Oz copper FR4 PCB. 3.3 °C/W 1. A thermal management device, such as a heatsink, is required to ensure proper operation of this device. The thermal management medium is required to maintain baseplate < 105ºC for full rated power. |
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