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SA8027 Datasheet(PDF) 2 Page - NXP Semiconductors |
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SA8027 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 22 page ![]() Philips Semiconductors Product data SA8027 2.5 GHz low voltage, low power RF fractional-N/IF integer frequency synthesizer 2 2001 Aug 21 853–2244 26947 GENERAL DESCRIPTION The SA8027 BICMOS device integrates programmable dividers, charge pumps and phase comparators to implement phase-locked loops. The device is designed to operate from 3 NiCd cells, in pocket phones, with low current and nominal 3 V supplies. The synthesizer operates at VCO input frequencies up to 2.5 GHz. The synthesizer has fully programmable main, auxiliary and reference dividers. All divider ratios are supplied via a 3-wire serial programming bus. The main divider is a fractional-N divider with programmable integer ratios from 512 to 65535. Separate power and ground pins are provided to the charge pumps and digital circuits. The ground pins should be externally connected to prevent large currents from flowing across the die and causing damage. VDDCP must be equal to or greater than VDD. The charge pump current (gain) is fully programmable, while ISET is set by an external resistance at the RSET pin (refer to section 1.5, Main Output Charge Pumps and Fractional Compensation Currents). The phase/frequency detector charge pump outputs allow for implementing a passive loop filter. FEATURES • Low phase noise • Low power • Fully programmable main and auxiliary dividers • Programmable Normal & Integral charge pumps outputs • Fast Locking Adaptive mode design • Internal fractional spurious compensation • Hardware and software power down • Split supply for V DD and VDDCP • Loop filter bandwidth programmability APPLICATIONS • 500 to 2500 MHz wireless equipment • Cellular phones (all standards) • WLAN • Portable battery-powered radio equipment. SR01649 1 2 3 4 5 6 7 8 9 11 12 13 14 15 16 17 18 19 20 LOCK TEST VDD GND RFin+ RFin– GNDCP PHP PHI GNDCP PON STROBE DATA CLOCK REFin+ REFin– RSET AUXin VDDCP PHA 10 Figure 1. TSSOP20 Pin Configuration 13 7 2 3 4 5 6 TOP VIEW 1 8 9 10 11 12 14 15 16 17 18 19 20 21 22 23 24 CLOCK REFin+ REFin– SR02176 N/C VDDPre GND GNDPre RFin+ RFin– GNDCP VDDCP RSET Figure 2. HBCC24 Pin configuration QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDD Supply voltage 2.7 – 3.6 V VDDCP Analog supply voltage VDDCP w VDD 2.7 – 3.6 V IDDCP+IDD Supply current Main and Aux. on – 7.7 – mA IDDCP+IDD Total supply current in power-down mode – 1 – µA fVCO Input frequency 500 – 2500 MHz fAUX Input frequency 100 – 550 MHz fREF Crystal reference input frequency 5 – 40 MHz fPC Maximum phase comparator frequency – 4 MHz Tamb Operating ambient temperature –40 – +85 °C ORDERING INFORMATION TYPE NUMBER PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION SA8027DH TSSOP20 Plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 SA8027W HBCC24 Plastic, heatsink bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm (Note 1) SOT564-1 NOTE: 1. The SA8027W will be released for production Q2, 2001. |
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