MCP8063 datasheet(5/20 Pages) MICROCHIP

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 2014 Microchip Technology Inc.

DS20005257B-page 5

MCP8063

FIGURE 1-1:

Allowable Power Dissipation (PD_MAX) as a Function of Ambient Temperature (TA).

Thermal Shutdown

TSD

—

170

—

°C

Thermal Shutdown

Hysteresis

TSD_HYS

—25

—

°C

Input Over Voltage

VOV

—18.5

—

TEMPERATURE SPECIFICATIONS

Electrical Specifications:

Unless otherwise specified, all limits are established for VDD = 12.0V, TA =+25°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Temperature

TOPR

-40

—

+125

°C

Storage Temperature Range

TSTG

-55

—

+150

°C

Package Thermal Resistances

Thermal Resistance, 8LD 4x4 DFN

JA

—48

—

°C/W

JC

—7

—

°C/W

Note 1:

Minimum and maximum parameter is not production tested and is specified by design and validation.

Derating applies for ambient temperatures outside the specified operating range (refer to Figure 1-1).

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications:

Unless otherwise specified, all limits are established for VDD = 12.0V,

Temperature = +25°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Note 1:

Minimum and maximum parameter is not production tested and is specified by design and validation.

Reference PCB, according to JEDEC standard EIA/JESD 51-9.

0.5

1.5

2.5

A (°C)

DFN-8

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