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STF6080C Datasheet(PDF) 3 Page - Sangdest Microelectronic (Nanjing) Co., Ltd |
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STF6080C Datasheet(HTML) 3 Page - Sangdest Microelectronic (Nanjing) Co., Ltd |
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3 / 4 page ![]() Technical Data Green Products Data Sheet N1764, Rev. - • China - Germany - Korea - Singapore - United States • • http://www.smc-diodes.com - sales@ smc-diodes.com • STF6080C Electrical Characteristics: * Pulse Width < 300µs, Duty Cycle <2% Thermal-Mechanical Specifications: Characteristics Symbol Condition Specification Units Junction Temperature TJ - -55 to +150 °C Storage Temperature Tstg - -55 to +150 °C Typical Thermal Resistance Junction to Case (per leg) RθJC DC operation 5.0 °C/W Approximate Weight wt - 2 g Case Style ITO-220AB Characteristics Symbol Condition Typ. Max. Units Forward Voltage Drop (per leg) * VF1 @ 15A, Pulse, TJ = 25 °C @ 30A, Pulse, TJ = 25 °C 0.54 0.68 - 0.85 V Reverse Current (per leg) * IR1 @VR = rated VR TJ = 25 °C 0.04 1.0 mA RSM Isolation Voltage (t = 1.0 second, R. H. < =30%, TA = 25 °C) VISO Clip mounting, the epoxy body away from the heatsink edge by more than 0.110" along the lead direction. - 4500 V Clip mounting, the epoxy body is inside the heatsink. - 3500 Screw mounting, the epoxy body is inside the heatsink. - 1500 |
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