STF10200LC datasheet(3/4 Pages) SMC

Part #	STF10200LC

Description	Guard ring for enhanced ruggedness and long term reliability

PDF	4 Pages

Scroll/Zoom	100%

Manufacturer	SMC [Sangdest Microelectronic (Nanjing) Co., Ltd]

Direct Link	http://www.smc-diodes.com/

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3 / 4 page

Technical Data

Green Products

Data Sheet N1771, Rev. -

• China - Germany - Korea - Singapore - United States •

• http://www.smc-diodes.com - sales@ smc-diodes.com •

STF10200LC

Electrical Characteristics:

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Junction Temperature

-55 to +150

°C

Storage Temperature

Tstg

-55 to +150

°C

Maximum Thermal

Resistance Junction to Case

(per leg)

RθJC

DC operation

5.0

°C/W

Approximate Weight

Case Style

ITO-220AB

Characteristics

Symbol

Condition

Max.

Units

Forward Voltage Drop

(per leg)*

VF1

@ 5A, Pulse, TJ = 25 °C

0.80

VF2

@ 5A, Pulse, TJ = 125 °C

0.75

Reverse Current (per leg) *

IR1

@VR = rated VR

TJ = 25 °C

1.0

IR2

@VR = rated VR

TJ = 125 °C

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

TA = 25 °C)

VISO

Clip mounting, the epoxy body away

from the heatsink edge by more than

0.110" along the lead direction.

4500

Clip mounting, the epoxy body is

inside the heatsink.

3500

Screw mounting, the epoxy body is

inside the heatsink.

1500

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