CAT24C01 datasheet(18/23 Pages) ONSEMI

18 / 23 page

CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16

www.onsemi.com

PACKAGE DIMENSIONS

WLCSP4, 0.84x0.86

CASE 567NX

ISSUE A

PITCH

0.18

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

RECOMMENDED

PACKAGE

OUTLINE

PITCH

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DATUM C, THE SEATING PLANE, IS DEFINED BY

THE SPHERICAL CROWNS OF THE CONTACT

BALLS.

4. COPLANARITY APPLIES TO SPHERICAL CROWNS

OF THE CONTACT BALLS.

5. DIMENSION b IS MEASURED AT THE MAXIMUM

CONTACT BALL DIAMETER PARALLEL TO DATUM C.

DIM

MIN

NOM

−−−

MILLIMETERS

0.16

0.18

0.40 BSC

−−−

A B

PIN A1

REFERENCE

0.05 C

0.08

0.10

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 4

0.15 REF

NOTE 3

NOTE 5

DETAIL A

0.025 REF

DETAIL A

OPTIONAL

BACKSIDE COAT

0.05

0.03 C

MAX

0.20

0.30

0.12

0.82

0.84

0.86

0.84

0.86

0.88

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