(All voltages referenced to GND)

AO, BO, ZO, YO, LO, LO2, LO3.................-0.3V to (VL + 0.3V)

_FAULT, D2FAULT/IRQ...........................................-0.3V to +6V

D3FAULT/ SDO (SPI is High)......................-0.3V to (VL + 0.3V)

D3FAULT/SDO (SPI is Low) ..................................-0.3V to +6V

TTL/SDI, SNGL/SCLK, HITH/CS, DI/TTLY,

DI/TTL2, DI/TTL3, SPI ........................................-0.3V to +6V

A, A, B, B, Z, Z, DIY, Y, DI2, DI3............................-40V to +40V

Short-Circuit Duration (_O, _FAULT, LO2,

D2FAULT/IRQ, LO3, D3FAULT/SDO to GND) .....Continuous

Thin QFN (derate 19mW/°C above +70°C)...............1520mW

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (Soldering, 10s).................................+300°C

Soldering Temperature (Reflow)......................................+260°C

(Note 1)

Electrical Characteristics

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

Supply Voltage

4.5

5.5

V

Supply Current

Outputs not switching, no load

9

14

mA

Logic Supply Voltage

1.62

5.5

V

RS-422 RECEIVERS (RxA, RxB, RxZ, RxY)

Differential Threshold Voltage

-200

+200

mV

Differential Input Hysteresis

230

mV

Single-Ended Input Current

+100

+160

μA

-270

-170

Low Differential Voltage Fault

Threshold

+270

+460

mV

-460

-270

Single-Ended Input Fault

Threshold

+15

+18

V

-18

-15

DIFFERENTIAL HTL RECEIVERS (RxA, RxB, RxZ)

Differential Threshold Voltage

-900

+900

mV

Differential Input Hysteresis

1

V

Single-Ended Input Current

+280

+460

μA

-270

-170

MAX14890E

Incremental Encoder Interface for RS-422,

HTL, and TTL with Digital Inputs

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics