Qualpack TSS463 / TSS461C

Rev. 2 – January 1999

13

4.3 Wafer Process Qualification

This section summarizes the global 1998 reliability results of the products manufactured with the same

technology as the VAN TSS463 and TSS461C (Z86 processes).

Wafer

Process

Device Types

Test Description

Step

Result

Comment

Z86

Microcontrollers

and dedicated

EFR Dynamic Life Test

LFR Dynamic Life Test

12h

500h

1000h

3/22888

1/1155

Z86

Z86

Memory, Asic,

TSS463

EFR Dynamic Life Test

LFR Dynamic Life Test

EFR Dynamic Life Test

LFR Dynamic Life Test

12h

500h

1000h

12h

500h

1000h

1/5209

1/685

Estimated

65 ppm

3.9 fit

Z86

TSS461C

EFR Dynamic Life Test

LFR Dynamic Life Test

12h

500h

1000h

Estimated

49 ppm

2.9 fit

Failure mechanisms

All

50%

17%

17%

17%

Poly silicide defect

metal

resistor shift

bonding

Global

All products

EFR Dynamic Life Test

LFR Life Test

12h

500h

1000h

4/28097

2/1840

165 ppm (20mm2)

10 fit (20mm2)