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STM32L071KB Datasheet(PDF) 117 Page - STMicroelectronics |
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STM32L071KB Datasheet(HTML) 117 Page - STMicroelectronics |
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117 / 136 page  DocID027101 Rev 3 117/136 STM32L071xx Package information 133 Figure 48. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball ,grid array recommended footprint Note: Non solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. e - 0.500 - - 0.0197 - F - 0.750 - - 0.0295 - ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 81. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 80. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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