MLX75303

Optical Switch SensorEyeC

390107530301

Page 11 of 12

Data Sheet

Rev. 001

Feb/09

10 Standard information regarding manufacturability of Melexis

products with different soldering processes

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitiv-

ity level according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)

•

IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

(classification reflow profiles according to table 5-2)

•

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices)

•

EN60749-20

Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat

Solderability SMD’s (Surface Mount Devices)

•

EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak tempera-

ture, temperature gradient, temperature profile etc) additional classification and qualification tests have to be

agreed upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of

adhesive strength between device and board.

Melexis is contributing to global environmental conservation by promoting lead free solutions. For more

information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of

the

use

of

certain

Hazardous

Substances)

please

visit

the

quality

page

on

our

website:

http://www.melexis.com/quality.asp

11 ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor products.